18-28.8万
苏州工业园区 | 7年以上经验
发布时间：2022-01-29 23:30:45 |
截止时间：2022-02-14
基本信息：
- 项目工程师
- 有经验要求
- 全职
- 1
职位描述及要求：
- Duties and Responsibilities
1.Production setup and production-readiness activities.
2.New product/process development and qualification activities.
3.Supporting new supply chain development activities.
4.Implementation plans for new packaging introductions.
5.Coordinating project schedules and team meetings between key groups.
6.Ensuring “on-time” deliverables.
7.Driving Assembly manufacturing efficiencies: cost, yield, cycle time.
8.Troubleshooting manufacturing line issues.
9.Failure analysis of reliability failures.
10.Generation of new ideas and intellectual property for the ISG portfolio.
Qualifications
1.Bachelor’s Degree in an applicable engineering discipline.
2.Minimum 7 years’ experience in semiconductor assembly manufacturing.
3.Working knowledge of the following Assembly processes such as: Thinning, Mount, Dicing, Die Bond, Wire 4.Bond, Lid/Lens Attach, Flip Chip, Encapsulation, Laser Mark, Ball Attach, Singulation, Surface Mount, Underfill.
5.Experience with statistical analysis techniques such as DOE, SPC, and data analysis.
6.Possess a solid understanding of semiconductor packaging materials.
Willing to travel.
岗位条件：
- 本科
- 英语 熟练
- 不限
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