Staff/Sr. Molding Process Engineer
Staff/Sr. Molding Process Engineer
面议
苏州工业园区 | 5年以上经验
发布时间:2021-12-17 08:52:03 | 截止时间:2022-03-29
基本信息:
  • 半导体技术
  • 有经验要求
  • 全职
  • 1
职位描述及要求:
  • Job Description:
    1. New process introduction & sustaining.
    2. Machine buy-off & product/material evaluation & qualification.
    3. Feasibility study & process optimization.
    4. Compile & maintain Engineering documents such as SOP/FMEA/Control-plan/O-CAP/SPEC, etc.
    5. Customers' sample build & qualification.
    6. Problem investigation & solving according to 8D discipline.
    7. Cost saving, Yield sustaining, OEE enhancement.
    8. Other tasks assigned by supervisors.

    Job Requirement:
    1. 5 years & above working experience in semiconductor.
    2. Plenty technical experience in EOL of SIP (System in Package) line.
    3. Hands-on experience in molding processes, compression mold is solid requirement.
    4. Involved into new line establish/transfer/setup.
    5. Basic understanding on ISO system.
    6. Strong logical thinking & data sensitive.
    7. Able to read & write in English.
    8. Communication with interpersonal skills.
    9. Well educated under 6sigma system & necessary QC tools.
岗位条件:
  • 本科
  • 英语 熟练
  • 不限
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  • 外商独资、外企办事处
  • 电子技术/半导体/集成电路
  • 1000-1999
  • 苏州工业园区西沈浒路88号
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